TIANSHUI HUATIAN TECHNOLOGY CO., LTD.(002185.CN)

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Introduction

Tianshui Huatian Technology Co.,Ltd. is mainly engaged in semiconductor integrated circuit, MEMS sensors, semiconductor components packaging and testing business. Package test products have 12 series more than 200 varieties. The company is a microelectronic backbone of Gansu province enterprises and innovative spirit of modern high-tech enterprises.

History

On December 25, 2003, Tianshui Huatian Technology Co., Ltd. was officially registered with a registered capital of 150 million yuan.

On November 20, 2007, the first listed company in Tianshui city was born, and The A-shares of Huatian Technology were successfully listed in Shenzhen Stock Exchange.

In October 2010, Xi 'an Tiansheng Electronics Co.,Ltd., a wholly-owned subsidiary of Tianshui Huatian Technology Co.,Ltd. went into production.

On November 24, 2013, Tianshui Huatian Technology Co.,Ltd. set up a wholly-owned subsidiary in Hong Kong with the Chinese name "Huatian Technology (Hong Kong) Industry Development Co.,Ltd.". On December 14, Huatian Technology and THE United States FCI company signed the "Shareholders' Equity Sale agreement."

On June 1, 2015, Huatian Technology increased the capital of Shenzhen Huatian Mike Optoelectronic Technology Co., Ltd. and realized the holding of it.

On November 27, 2015, Tianshui Huatian Technology Co.,Ltd. completed a private placement to raise 2 billion yuan.

Business

Tianshui Huatian Technology Co.,Ltd. is mainly engaged in semiconductor integrated circuit packaging and testing business. The annual packaging scale and sales revenue of the company's IC are ranked the second in the same industry listed companies in China, and the company has set up industrial bases in Tianshui, Xi 'an, Shanghai, Kunshan, Shenzhen and Phoenix in the United States. The industrial scale of the company ranks among the top ten in the global IC sealing and testing industry.

The packaged products of the company's integrated circuit include DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/TQFP, QFN/DFN, BGA/LGA, FC, MCM (MCP), SiP, WLP, TSV, Bumping, MEMS, and Fout, and around. The products are mainly used in computer, network communication, consumer electronics and intelligent mobile terminals, Internet of things, industrial automation control, automotive electronics and other electronic complete machines and intelligent fields.

北新建材 深圳机场 爱施德 亿晶光电 中原传媒